july 2010 doc id 6085 rev 6 1/7 7 stps1045b power schottky rectifier features negligible switching losses low forward voltage drop low capacitance high reverse avalanche surge capability avalanche specification description high voltage dual schottky rectifier suited for switch mode power supplies and other power converters. packaged in dpak, this device is intended for use in high frequency circuitries where low switching losses are required. j table 1. device summary symbol value i f(av) 10 a v rrm 45 v t j 175 c v f (max) 0.57 v dpak k k a a www.st.com
characteristics stps1045b 2/7 doc id 6085 rev 6 1 characteristics to evaluate the conduction losses use the following equation: p = 0.42 x i f(av) + 0.015 i f 2 (rms) table 2. absolute maximum ratings symbol parameter value unit v rrm repetitive peak reverse voltage 45 v i f(rms) / pin forward rms current 7 a i f(av) average forward current t c = 150 c = 0.5 10 a i fsm surge non repetitive forward current t p = 10 ms sinusoidal 75 a i rrm repetitive peak reverse current t p = 2 s f= 1 khz 1 a p arm repetitive peak avalanche power t p = 1 s t j = 25 c 4000 w t stg storage temperature range - 65 to + 150 c t j maximum operating junction temperature (1) 1. condition to avoid thermal runaway for a diode on its own heatsink 175 c dv/dt critical rate of rise of reverse voltage 10000 v/s table 3. thermal parameters symbol parameter value unit r th(j-c) junction to case 3 c/w table 4. static electrical characteristics symbol parameter test conditions min. typ. max. unit i r (1) 1. pulse test: tp = 5 ms, < 2% reverse leakage current t j = 25 c v r = v rrm 100 a t j = 125 c 7 15 ma v f (2) 2. pulse test: tp = 380 s, < 2% forward voltage drop t j = 25 c i f = 10 a 0.63 v t j = 125 c 0.50 0.57 t j = 25 c i f = 20 a 0.84 t j = 125 c 0.65 0.72 dptot dtj < 1 rth(j-a)
stps1045b characteristics doc id 6085 rev 6 3/7 figure 1. average forward power dissipation versus average forward current figure 2. average forward current versus ambient temperature ( : 0.5) 0123456789101112 0 1 2 3 4 5 6 7 8 p(w) f(av) t =tp/t tp i (a) f(av) = 1 = 0.05 = 0.1 = 0.2 = 0.5 0 25 50 75 100 125 150 175 0 2 4 6 8 10 12 i (a) f(av) t (c) amb r=r th(j-a) th(j-c) r =15c/w th(j-a) r =70c/w th(j-a) figure 3. normalized avalanche power derating versus pulse duration figure 4. normalized avalanche power derating versus junction temperature 0.001 0.01 0.1 0.01 1 0.1 10 100 1000 1 t (s) p p(t) p (1s) arm p arm 0 0.2 0.4 0.6 0.8 1 1.2 25 50 75 100 125 150 t (c) j p(t) p (25 c) arm arm j figure 5. non repetitive surge peak forward current versus overload duration (maximum values) figure 6. relative variation of thermal impedance junction to case versus pulse duration 1e-3 1e-2 1e-1 1e+0 0 20 40 60 80 100 120 i m t =0.5 i (a) m t(s) t =50c c t =100c c t =150c c 1e-4 1e-3 1e-2 1e-1 1e+0 0.0 0.2 0.4 0.6 0.8 1.0 z/r th(j-c) th(j-c) t =tp/t tp t (s) p = 0.5 = 0.2 = 0.1 single pulse
characteristics stps1045b 4/7 doc id 6085 rev 6 figure 7. reverse leakage current versus reverse voltage applied (typical values) figure 8. junction capacitance versus reverse voltage applied (typical values) 0 5 10 15 20 25 30 35 40 45 1e-1 1e+0 1e+1 1e+2 1e+3 1e+4 1e+5 i (a) r v (v) r t =125c j t =150c j t =100c j t =50c j t =25c j t =75c j 12 51020 50 100 200 500 1000 c(pf) v (v) r f=1mhz v =30mv t =25c osc rms j figure 9. forward voltage drop versus forward current figure 10. thermal resistance junction to ambient versus copper surface under tab 0.1 1.0 10.0 100.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 t =125c (maximum values) j t =125c (typical values) j t =25c (maximum values) j i (a) fm v (v) fm 0 2 4 6 8 101214161820 0 20 40 60 80 100 r th(j-a) (c/w) s(cu)(cm ) 2 epoxy printed circuit board, copper thickness: 35 m
stps1045b package information doc id 6085 rev 6 5/7 2 package information epoxy meets ul94, v0. lead-free packages in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 11. dpak footprint (dimensions in mm) table 5. dpak dimensions ref. dimensions millimeters inches min. max min. max. a 2.20 2.40 0.086 0.094 a1 0.90 1.10 0.035 0.043 a2 0.03 0.23 0.001 0.009 b 0.64 0.90 0.025 0.035 b2 5.20 5.40 0.204 0.212 c 0.45 0.60 0.017 0.023 c2 0.48 0.60 0.018 0.023 d 6.00 6.20 0.236 0.244 e 6.40 6.60 0.251 0.259 g 4.40 4.60 0.173 0.181 h 9.35 10.10 0.368 0.397 l2 0.80 typ. 0.031 typ. l4 0.60 1.00 0.023 0.039 v2 0 8 0 8 h l4 g b l2 e b2 d a1 r r c a c2 0.60 min. v2 a2 6.7 6.7 3 3 1.6 1.6 2.3 2.3
ordering information stps1045b 6/7 doc id 6085 rev 6 3 ordering information cooling method : by conduction (c) 4 revision history table 6. ordering information order code marking package weight base qty delivery mode stps1045b s1045 dpak 0.30 g 75 tube stps1045b-tr s1045 2500 tape and reel table 7. document revision history date revision changes jul-2003 3b last issue 21-apr-2005 4 ipak package removed 03-nov-2005 5 dpak foot print dimensions updated. 01-jul-2010 6 updated figure 9. updated ecopack statement.
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